Disco – supply chain
Market Position and Market Share Disco Corporation holds an undisputed global leadership position in semiconductor backend precision processing equipment, operating with near-monopoly economics in its core niches. The company specializes in the “Kiru, Kezuru, Migaku” (Cut, Grind, Polish) domains. Driven by the surge in High Bandwidth Memory (HBM), advanced packaging (CoWoS/2.5D/3D), and silicon carbide (SiC) […]
Disco – business model
Corporate History Foundation and Abrasive Wheel Origins(1937–1968) Founded in 1937 as Dai-Ichi Seitosho Co., Ltd. in Hiroshima, the business began by manufacturing industrial abrasive grinding wheels. In the 1950s, the company developed ultra-thin resinoid blades, establishing the technical foundation for precision micro-abrasive cutting. Semiconductor Pivot and Name Transformation(1969–1989) In 1969, the company introduced the “Dicing […]